LTE-A EM060K-GL CAT 6 LTE-A MODULE WITH AN M.2 KEY-B FORM FACTOR
- LTE Cat 6 module, LTE-A supported, 2*CA , MIMO
- 42.0mm × 30.0mm × 2.3mm
- Max. data rates of 300Mbps downlink / 50Mbps uplink
- M.2 package, key-B
- Extended temperature range of -40°C to +85°C
- Powered by the Snapdragon® X12 LTE Modem from Qualcomm Technologies Inc
The EM060K-GL is an LTE-A Cat 6 module with an M.2 form factor measuring 42.0mm × 30.0mm × 2.3mm, developed in accordance with the 3GPP Release 12 specification, which supports a theoretical downlink peak data rate of 300Mbps and a theoretical uplink peak data rate of 50Mbps. The module is compatible with Quectel’s LTE-A Cat 6 module EM06, Cat 12 modules EM12-G/EM121R-GL/EM120R-GL,Cat 16 module EM160R-GL and 5G modules RM500Q/RM502Q Series, which enables migration between different modules.
The EM060K-GL is designed for the global market and covers nearly all mainstream carriers worldwide. The module supports Qualcomm® IZat™ location technology gpsOne 9HT (GPS, GLONASS, BeiDou/Compass and Galileo). The integrated GNSS greatly simplifies product design, and provides quicker, more accurate and more dependable positioning capability.
A rich set of Internet protocols, industry-standard interfaces and abundant functionalities (USB drivers for Windows, Linux, Android/optional built-in eSIM) allow the module to serve a wide range of applications such as industrial routers, home gateways, STB, industrial laptops, consumer laptops, industrial PDAs, rugged tablet PCs, and digital signage.
FEATURES
- LTE Cat 6 module
- 42.0mm × 30.0mm × 2.3mm
- Max. data rates of 300Mbps downlink / 50Mbps uplink
- M.2 package, key-B
- Extended temperature range of -40°C to +85°C
- LTE-A Cat 6 module with M.2 form factor
- Support DL 2 Carrier Aggregation and 64QAM
- Worldwide LTE-A and UMTS/HSPA+ coverage
- Built-in eSIM (optional), DSSA
- Low power mode
- Multi-constellation GNSS receiver available for applications requiring fast and accurate fixes in any environment
- MIMO technology meets demands for data rate and link reliability in modem wireless communication systems
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