Quectel RM551E-GL 5G Sub-6GHz & mmWave M.2 Module, rel 17, Qualcomm Snapdragon x75 chipset

Quectel RM551E-GL M.2 5G Module Specifications：

RM551EGL00AA-8M8-SGASA

* Target Market: Global

* Product type: 5G Module

* Chipset: Qualcomm Snapdragon x75

* 5G: 3GPP Release 17 NSA/SA operation, Sub-6 GHz + mmWave

* Form factor: M.2

* Dimensions: 52.0× 30.0 × 2.3mm

* 5G:
– 5G Sub-6 NSA Band: n1/ 2/ 3/ 5/ 7/ 8/ 12/ 13/ 14/ 18/ 20/ 25/ 26/ 28/ 29(Rx)/ 30/ 38/ 40/ 41/ 48/ 66/ 70/ 71/ 75/ 76/ 77/ 78/ 79/ 92/ 94
– 5G Sub-6 SA Band: n1/ 2/ 3/ 5/ 7/ 8/ 12/ 13/ 14/ 18/ 20/ 25/ 26/ 28/ 29(Rx)/ 30/ 38/ 40/ 41/ 48/ 66/ 70/ 71/ 75/ 76/ 77/ 78/ 79/ 91/ 92/ 93/ 94
– 5G CA/BW: Up to 5 DL CA, 300 MHz NR BW mmWave: ≥ 8CC
– DL 4 × 4 MIMO n1/ 2/ 3/ 7/ 25/ 30/ 38/ 40/ 41/ 48/ 66/ 77/ 78/ 79
– UL 2 × 2 MIMO n38/ 41/ 48/ 77/ 78/ 79

* 4G:
– LTE Category: DL Cat 20/ UL Cat 18
– LTE Bands: B1/ 2/ 3/ 4/ 5/ 7/ 8/ 12/ 13/ 14/ 17/ 18/ 19/ 20/ 25/ 26/ 28/ 29/ 30/ 32/ 34/ 38/ 39/ 40/ 41/ 42/ 43/ 46(LAA)/ 48/ 66/ 71
– DL 4 × 4 MIMO: B1/ 2/ 3/ 4/ 7/ 25/ 30/ 38/ 40/ 41/ 42/ 43/ 48/ 66
– WCDMA: B1/ 2/ 4/ 5/ 8/ 19

 

* Weight：

* Temperature range:
– -30°C ~ +70°C (Operation Temperature)
– -40°C ~ +85°C (Extended Temperature)

* Control via AT Commands: 3GPP TS27.007 and Quectel Enhanced AT Commands

* Data Transmission:
– 5G SA Sub-6: Max. 2.4Gbps (DL)/ Max. 900Mbps (UL)
– 5G NSA Sub-6: Max. 3.2Gbps (DL)/ Max. 600Mbps (UL)
– 5G NSA mmWave: Max. 4.0Gbps (DL)/ Max. 1.4Gbps (UL)

* SMS

* Protocols: TCP/UDP/FTP/HTTP/HTTPS /PING/SMS

* Interfaces:
– (U)SIM × 2
– USB 2.0/3.0/3.1
– PCle: PCIe 4.0
– Antenna: Sub-6/GNSS x 4, mmWave x 2

* Enhanced Features
– MIMO: Sub-6 (4 x 4 DL, UL 2 x 2); mmWave (DL 2 x 2, UL 2 x2)
– Audio
– VoLTE：Optional
– DTMF: Dual-tone Multi-frequency
– DFOTA: Delta Firmware over the Air
– GNSS: GPS/GLONASS/Beidou/Galileo
– (U)SIM insert inspect